Epoxy Liquid Binder Fast Setting / Low
Temperature
PolyKrete 222 is a two component, 100% solid epoxy system. It
is high modulous, moisture insensitive and low temperature (30°F) curing system.
It is used as a coating, resurfacing or repair in areas where low down time is
required. At 30°F - 35°F it will yield a hard, dense, abrasion resistant
surface. Above 65°F PolyKrete 222 treated surface can be opened up to traffic in
as little time as three hours.
1- PolyKrete 222 is a low viscosity, high modulous adhesive and mortar binder
for horizantal surfaces.
2- PolyKrete 222 Gel is a non-sag gel for vertical and overhead repairs of
structural concrete, wood or steel.